Integrated circuit electronic package



FIG. 1 is a left, front perspective view showing my new integratedcircuit electronic package design as it is attached to an integratedcircuit;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side elevational view thereof which is a mirror imageof the left side elevational view.

The ornamental design for an integrated circuit electronic package, asshown and described.